Mid Mount Micro SD card connector push push,H1.8mm,dip with CD pin KLS1-TF-003E
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Mid Mount Micro SD card connector push push,H1.8mm,dip with CD pin
Material:
Housing:High Temperature Thermoplastic,UL94V-0,Black.
Terminal:Copper Alloy .
Shell:Stainless steel.
Contact:Contact Area:Au G/F,Solder area:Matte tin 80u” Min;Under plate Ni 30u” Min all over.
CD Pin:Contact Area:Au G/F,Under plate Ni 30u” Min all over.
Electrical:
Rated current:1.0 A
Rated Voltage:30V
Contact Resistance50mΩ Max.
Insulation Resistance:100...
Micro SD card connector push push,H1.85mm,with CD pin KLS1-TF-003D
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Micro SD card connector push push,H1.85mm,with CD pin
Material:
Insulator:High Temperature Thermoplastic,LCP,UL94V-0.
Contact:Copper Alloy T=0.15,Plated 50u” Ni Overall.
Plated Au Selective Contact Area Plated 30u”-70u” Sn Over Ni On Solder Area.
Shell:T=0.15,Plated 30u” Ni Overall min. Plated 0.5u” Au Selective ContactArea
Electrical:
Current Rating:0.5mA amx.
Voltage Rating:3.3V
Ambient Humidity Range:95% R.H. Max.
Co...
Micro SD card connector push push,H1.85mm,with CD pin,GOLD KLS1-TF-003C
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Micro SD card connector push push,H1.85mm,with CD pin,GOLD
Material:
Insulator:High Temperature Thermoplastic,LCP,UL94V-0.
Contact:Copper Alloy T=0.15,Plated 50u” Ni Overall.
Plated Au Selective Contact Area Plated 30u”-70u” Sn Over Ni On Solder Area.
Shell:T=0.15,Plated 30u” Ni Overall min. Plated 0.5u” Au Selective Contact Area.
Electrical:
Current Rating:0.5mA AC/DC amx.
Voltage Rating:125V AC/DC
Ambient Humidity Ran...
Mid Mount Micro SD card connector push push,H1.8mm,with CD pin KLS1-TF-003A
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Mid Mount Micro SD card connector push push,H1.8mm,with CD pin
Material:
Insulator:High Temperature Thermoplastic,UL94V-0.
Contact:Copper Alloy ,Plated 50u” Ni Overall.
Plated Au Selective Contact Area Plated 100u” Sn Over Ni On Solder Area.
Shell:Plated 50u” Ni Overall. Plated 1u” Au Selective Contact Area.
Electrical:
Current Rating:0.5mA AC/DC amx.
Voltage Rating:125V AC/DC
Ambient Humidity Range:95% R.H. Max.
Contact Resi...
Micro SD card connector push push,H1.85mm,with CD pin KLS1-TF-003
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Product Information
Micro SD card connector push push,H1.85mm,with CD pin
Material:
Insulator:High Temperature Thermoplastic,UL94V-0.
Contact:Copper Alloy T=0.15,Plated 50u” Ni Overall. Plated Au Selective
Contact Area Plated 30u”-70u” Sn Over Ni On Solder Area.
Shell:T=0.15,Plated 30u” Ni Overall min. Plated 0.5u” Au Selective Contact Area
Electrical:
Current Rating:0.5 A
Voltage Rating:3.3V
Ambient Humidity Range:95% R.H. Max.
Contact Re...
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Double SIM Card Connector,PUSH PULL,H3.0mm
Material:
Housing:Hi-TEMP Plastic,UL94V-0.Black.
Terminal:Copper alloy
Shell:Stainless Steel
Finish:
Terminal:Au Plated on the contact area ,
Matte tin plated on the solder
tails underplated over nickel
Shell:Au Plated on the solder tails
underplated over nickel
Electrical:
Contact Resistance:50mΩ Max
Withstanding Voltage:350V AC rms for 1 minut
Insulation resistance:1000MΩ ...
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Double SIM Card Connector,PUSH PULL,H3.0mm
Material:
Housing:Hi-Temperature Plastic,UL94V-0.Black.
Terminal:Copper Alloy.Gold Flash Plated On All Terminal,AND 50u” Min Nickel Underplated On Allover.
Shell:Stainless Steel.50u” Nickel Underplated On Allover,Gold Flash On Solder PAD.
Electrical:
Current Rating:0.5 A.
Voltage Rating:5.0 vrms.
Insulation Resistance:1000MΩ Min.At DC500V DC.
Withstanding Voltage:250V AC RMS For 1 Minute.
Contac...
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Nano SIM Card Connector;PUSH PULL,6Pin,H1.40mm
Material:
Insulator:LCP,UL94V-0.
Contact:C5210.Plated 50u” Ni Overall,Contact All Au 1u.
Shell:SUS,Plated 50u” Ni Overall,PAD Au 1u.
Electrical:
Current Rating:0.5A AC/DC max.
Voltage Rating:30V AC/DC
Contact Resistance:30mΩ Max.
Insulation Resistance:1000MΩ Min
Operating Temperature: -45ºC~+85ºC
Nano SIM Card Connector,PUSH PUSH,6Pin,H1.37mm,with CD Pin KLS1-SIM-066
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Nano SIM Card Connector,PUSH PUSH,6Pin,H1.37mm,with CD Pin
Material:
Insulator:High Temperature Thermoplastic,UL94V-0.
Contact:Copper Alloy,Plated 50u” Ni Overall,PAD Au 1u”.
Shell:SUS.All Ni 30U/MIN.
Electrical:
Current Rating:0.5A ampers
Voltage Rating:5V AC/DC
Contact Resistance:100mΩ Max.
Insulation Resistance:1000MΩ Min./500V DC
Operating Temperature: -45ºC~+85ºC
Nano SIM Card Connector;MID Mount Tray type,6Pin,H1.5mm,with CD Pin KLS1-SIM-100
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Nano SIM Card Connector;MID Mount Tray type,6Pin,H1.5mm,with CD Pin
Material:
Plastics:LCP,UL94V-0.Black.
Contact:C5210
Shell:SUS304
Tray:LCP,UL94V-0.Black.
Plating:
Contact:Contact Area:G/F Plating;Soldertail Area:80u” Matte Tin
Shell:Plating over 30u” Ni Solderable 30u” Ni Plating over all.Contact and tail coplanarity to be 0.10mm all.
Nano SIM Card Connector,6Pin,H1.4mm,Hinged Type,with CD Pin KLS1-SIM-101
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Nano SIM Card Connector,6Pin,H1.4mm,Hinged Type,with CD Pin
Material:
Housing:High Temperature Thermoplastic,UL94V-0.Black.
Terminal:Copper Alloy,Plated Gold on the contact area and solder tails,Underplated Nickel over all.
Shell:Stainless Steel,Plated gold on the solder tails,Underplated Nickel over all.
Electrical:
Rated current:0.5A Max
Rated Voltage:30V AC
Contact Resistance:100mΩ Max.
Insulation Resistance:1000MΩ Min./500V DC
Dielectric Withsta...
Nano SIM Card Connector,6Pin,H1.4mm,Hinged Type,with CD Pin KLS1-SIM-077A
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Nano SIM Card Connector,6Pin,H1.4mm,Hinged Type,with CD Pin
Material:
Insulator:High Temperature Thermoplastic,UL94V-0.
Contact:Copper Alloy,Plated 50u” Ni Overall Contact All Au 1U.
Shell:SUS.All Ni 30U MIN.
Electrical:
Current Rating:0.5A AC/DC MAX.
Voltage Rating:125V AC/DC
Ambient Humidity Range:95% R.H. Max.
Contact Resistance:80mΩ Max.
Insulation Resistance:100MΩ Min./100V DC
Mating Cycles:5000 Insertions.
Operating Temperature: -45ºC~+85...
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Nano SIM Card Connector;PUSH PULL,6Pin,H1.35mm
Material:
Insulator:High Temperature Thermoplastic,UL94V-0.
Contact:C5210.Plated 50u” Ni Overall,Contact All Au 1u.
Shell:SUS,Plated 50u” Ni Overall,PAD Au 1u.
Electrical:
Current Rating:0.5A AC/DC max.
Voltage Rating:125V AC/DC
Contact Resistance:100mΩ Max.
Insulation Resistance:1000MΩ Min.500V DC
Operating Temperature: -45ºC~+85ºC
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Material:
Housing:High Temp.Thermoplastic,UL94V-0.Black
Contact:Copper Alloy 0.10T,Gold Flash On Contact Area and Solder Area 50U” Min Nickel Under-Plated
Shell:Stainless Steel 0.10T,Nickel Plating Over ALL
Electrical:
Current Rating:1A
Contact Resistance:100mΩ Max.
Insulation Resistance:500MΩ Min
Dielectric Withstanding Voltage:500V R.M.S. Min
Life Test:1500 Cycles