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Product
Connectors
SIM card connectors & Micro SIM card connectors & Nano SIM Card Connectors
Micro SIM Card Connector,8P+1P,PUSH PUSH,H3.65mm KLS1-SIM-096
Product Images Product Information Micro SIM Card Connector,8P+1P,PUSH PUSH,H3.65mm Material: Housing:High Temperature Thermoplastic,UL94V-0,Black. Terminal:Copper Alloy.Contact Au:G.F Plating Shell:Stainless Steel.Slider Plating Au:1u”,Ni:30u” Min. Electrical: Current Rating: 1.0A Rating Voltage:50V Contact Resistance:100mΩ Max. Insulation Resistance:1000MΩ Min./500V DC Dielectric Withstanding Voltage:500V AC Humidity:80% R.H. Max. Durability:5000 Cycles Min. Operating...
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Micro SIM Card Connector,6P+1P,PUSH PUSH,H1.85mm,Reverse MID Mount KLS1-SIM-097
Product Images Product Information Micro SIM Card Connector,6P+1P,PUSH PUSH,H1.85mm,Reverse MID Mount Material: Insulator:High Temperature Thermoplastic,UL94V-0,Black. Contact:Copper Alloy.Plated 30u” Ni Overall,Solder Area:Tin,Contact G/F Shell:Stainless,30u” Ni Overall Plated G/F Selective Contact Area. Electrical: Current Rating:0.5A max. Voltage Rating:50V DC max. Ambient Humidity Range:95% R.H. Max. Contact Resistance:100mΩ Max. Insulation Resistance:1000MΩ Min./250V...
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[Copy] Micro SIM Card Connector,6P+1P,PUSH PUSH,H1.85mm,Reverse MID Mount KLS1-SIM-097
Product Images Product Information Micro SIM Card Connector,6P+2P With Switch,PUSH PUSH,H1.27mm NOTE 1.LEAD Co-planarity:Max 0.08mm 2.No rust.contamination.damage nor deformation effecting on function 3.Switch moving area 4.Non-cumulative tolerance 5.Circuit Drawing of switch Material: A:Base Insulator:LCP,Black. B:Cover:Stainless,Not hold down:Nickel;Hold down:Au flash over Nickel. C:Contact Terminal:Copper Alloy.Au over Nickel D:CAM Plate:Copper Alloy,Nickel. E:CAM Slider:LCP,Bl...
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Micro SIM Card Connector,6P+1P With Switch,PUSH PUSH,H1.29mm KLS1-SIM-093
Product Images Product Information Micro SIM Card Connector,6P+1P With Switch,PUSH PUSH,H1.29mm Material: Housing:High Temperature Thermoplastic,UL94V-0 Contact:Copper Alloy,Au 1u”,Solder area:Gold Flash;Under plate Ni 40u” Min all over Shell:SUS,Plated 30U” Ni Overall,Solder area:Gold Flash Electrical: Current Rating: 0.5A Voltage Rating:50V DC Max. Contact Resistance:100mΩ Max. Dielectric Withstanding Voltage:500V AC Insulation Resistance:1000MΩ Min./250VDC Oper...
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Micro SIM Card Connector,8P+1P With Switch,PUSH PUSH,H1.56mm KLS1-SIM-094
Product Images Product Information Micro SIM Card Connector,8P+1P With Switch,PUSH PUSH,H1.56mm Material: Housing:High Temperature Thermoplastic,UL94V-0 Contact:Copper Alloy,Au 1u”,Solder area:Gold Flash;Under plate Ni 40u” Min all over Shell:SUS,Plated 30U” Ni Overall,Solder area:Gold Flash Electrical: Current Rating: 1.0A Voltage Rating:50V Contact Resistance:100mΩ Max. Dielectric Withstanding Voltage:500V AC Insulation Resistance:1000MΩ Min./250VDC Operating Te...
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Micro SIM Card Connector,8P+2P,PUSH PUSH,H1.28mm KLS1-SIM-095
Product Images Product Information Micro SIM Card Connector,8P+2P,PUSH PUSH,H1.28mm Material: Insulator:High Temperature Thermoplastic,UL94V-0,Black. Contact:Copper Alloy.Gold or Nickel. Shell:Stainless.Gold or Nickel. Solder Area:Matte Tin 80u” Plated’Gold Flash. Electrical: Current Rating: 1A Rating Voltage:30V Contact Resistance:100mΩ Max. Insulation Resistance:1000MΩ Min./500V DC Dielectric Withstanding Voltage:500V AC Mating Cycles:5000 Insertions Operating Tempera...
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6P+2P With Switch SIM Card Connector,Hinged type,H2.5mm KLS1-SIM-010B
Product Images Product Information 6P+2P With Switch SIM Card Connector,Hinged type,H2.5mm Order Information: KLS1-SIM-010B-H2.5-8P-1-R Pins:6+2pin with switch 1=Without peg R=Roll pack T=Tube pack Material: Insulator body:LCP. Color:Black Contact:Phosphor Bronze Plating: Finsh:Tin Gold or Duplex plated. Standard:Gold flash 3u” all over Nickel Electrical: Current Rating:0.5A. Dielectric Withstanding Voltage:500V AC Insulation Resistance:1000MΩ Min Contact Resistance:30mΩ ...
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6P+2P With Switch SIM Card Connector,Hinged type,H2.5mm KLS1-SIM-012C
Product Images Product Information 6P+2P With Switch SIM Card Connector,Hinged type,H2.5mm Order Information: KLS1-SIM-012C-6+2P-R Pins:6+2pin with switch R=Roll pack T=Tube pack Material: Housing:LCP UL94V-0 Contact Terminal:Phosphor Bronze Metallic Shell:Stainless Steel-SUS304 Plating: Contact Terminal Plating Contact Area:5μ” Gold Soldering Area:100μ” Tin Under-plating:50μ” Nickel above Electrical: Voltage Rating:50 V max Current Rating:1A max...
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Double SIM Card Connector,PUSH PULL,H3.0mm KLS1-SIM2-002A
Product Images Product Information Double SIM Card Connector,PUSH PULL,H3.0mm Material: Housing:Hi-TEMP Plastic,UL94V-0.Black. Terminal:Copper alloy Shell:Stainless Steel Finish: Terminal:Au Plated on the contact area , Matte tin plated on the solder tails underplated over nickel Shell:Au Plated on the solder tails underplated over nickel Electrical: Contact Resistance:50mΩ Max Withstanding Voltage:350V AC rms for 1 minut Insulation resistance:1000MΩ ...
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2 In 1 Micro SIM & SD Card Connector, 8P,H2.26mm KLS1-SIM-109
Product Images Product Information 2 In 1 Micro SIM & SD Card Connector, 8P,H2.26mm Material: Insulator:High Temp Thermoplastic,UL94V-0.Black. Terminal:Copper Alloy,Gold plating in contact area 1u”,Soldering Area gilding 1u” Upper Shell:Stainless Steel,Plate Nickel 50u”. Down Shell:SUS304 R-1/2H T=0.10mm,Plate Nickel 50u”. Electrical: Insertion Force 1kgf Max.Withdrawal Force 0.1kgf Min. Durability:SIM 5000 Cycles, Contact Resistance:Before testing 80mΩ Max,Afte...
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Double SIM Card Connector,PUSH PULL,H3.0mm KLS1-SIM-033
Product Images Product Information Double SIM Card Connector,PUSH PULL,H3.0mm Material: Housing:Hi-Temperature Plastic,UL94V-0.Black. Terminal:Copper Alloy.Gold Flash Plated On All Terminal,AND 50u” Min Nickel Underplated On Allover. Shell:Stainless Steel.50u” Nickel Underplated On Allover,Gold Flash On Solder PAD. Electrical: Current Rating:0.5 A. Voltage Rating:5.0 vrms. Insulation Resistance:1000MΩ Min.At DC500V DC. Withstanding Voltage:250V AC RMS For 1 Minute. Contac...
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2 In 1 SIM Card +Micro SD Connector,PUSH PULL,H2.7mm KLS1-SIM-024
Product Images Product Information 2 In 1 SIM Card +Micro SD Connector,PUSH PULL,H2.7mm Electrical: Voltage:100V AC Current:0.5A Max. Contact Resistance:100mΩ Max. Dielectric Withstanding Voltage:500V AC. Insulation Resistance:1000MΩ Min Mechanical: Card Insertion withdrawal Force:13.8N Max. Push In Strength:19.6N Max. Durability:10000 Cycles. Operating Temperature: -45ºC~+85ºC Electrical: Voltage:100V AC Current:0.5A Max. Contact Resistance:100mΩ Max. Dielectric Withstandin...
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Nano SIM Card Connector;PUSH PULL,6Pin,H1.40mm KLS1-SIM-113
Product Images Product Information Nano SIM Card Connector;PUSH PULL,6Pin,H1.40mm Material: Insulator:LCP,UL94V-0. Contact:C5210.Plated 50u” Ni Overall,Contact All Au 1u. Shell:SUS,Plated 50u” Ni Overall,PAD Au 1u. Electrical: Current Rating:0.5A AC/DC max. Voltage Rating:30V AC/DC Contact Resistance:30mΩ Max. Insulation Resistance:1000MΩ Min Operating Temperature: -45ºC~+85ºC
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Nano SIM Card Connector,PUSH PUSH,6Pin,H1.37mm,with CD Pin KLS1-SIM-066
Product Images Product Information Nano SIM Card Connector,PUSH PUSH,6Pin,H1.37mm,with CD Pin Material: Insulator:High Temperature Thermoplastic,UL94V-0. Contact:Copper Alloy,Plated 50u” Ni Overall,PAD Au 1u”. Shell:SUS.All Ni 30U/MIN. Electrical: Current Rating:0.5A ampers Voltage Rating:5V AC/DC Contact Resistance:100mΩ Max. Insulation Resistance:1000MΩ Min./500V DC Operating Temperature: -45ºC~+85ºC
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Nano SIM Card Connector,PUSH PUSH,6Pin,H1.25mm,with CD Pin KLS1-SIM-103
Product Images Product Information Nano SIM Card Connector,PUSH PUSH,6Pin,H1.25mm,with CD Pin Material: Contact:Copper Alloy.Au over Ni. Housing:Glass Filled LCP. Shell:Stainless.Au over Ni.GND Frame:Copper Alloy.Au over Ni. Detection Switch:Copper Alloy.Au over Ni.Slide:Glass Filled Pa10t. Spring:Stainless. Hook:Stainless. Electrical: Rated current:0.5A Max Rated Voltage:30V AC Contact Resistance:100mΩ Max. Insulation Resistance:1000MΩ Min./500VDC Dielectric Withstanding Voltage:500...
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Nano SIM Card Connector,Tray type,6Pin,H1.55mm,with CD Pin KLS1-SIM-104
Product Images Product Information Nano SIM Card Connector,Tray type,6Pin,H1.55mm,with CD Pin Electrical: Current Rating:1 Amp/Pin.MAX. Voltage:30V DC.MAX Low Level Contact Resistance:30mΩ Max.Initially. Dielectric Withstanding Voltage:500V AC MIN.For 1 minute. Insulation Resistance:100MΩ Min.500V DC .For 1 minute. Durability:1500 Cycles. Operating Temperature: -45ºC~+85ºC
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Nano SIM Card Connector,Tray type,6Pin,H1.5mm,with CD Pin KLS1-SIM-102
Product Images Product Information Nano SIM Card Connector,Tray type,6Pin,H1.5mm,with CD Pin Electrical: Current Rating:1 Amp/Pin.MAX. Voltage:30V DC.MAX Low Level Contact Resistance:30mΩ Max.Initially. Dielectric Withstanding Voltage:500V AC MIN.For 1 minute. Insulation Resistance:100MΩ Min.500V DC .For 1 minute. Durability:1000 Cycles. Operating Temperature: -45ºC~+85ºC
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Nano SIM Card Connector;MID Mount Tray type,6Pin,H1.5mm,with CD Pin KLS1-SIM-100
Product Images Product Information Nano SIM Card Connector;MID Mount Tray type,6Pin,H1.5mm,with CD Pin Material: Plastics:LCP,UL94V-0.Black. Contact:C5210 Shell:SUS304 Tray:LCP,UL94V-0.Black. Plating: Contact:Contact Area:G/F Plating;Soldertail Area:80u” Matte Tin Shell:Plating over 30u” Ni Solderable 30u” Ni Plating over all.Contact and tail coplanarity to be 0.10mm all.
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Nano SIM Card Connector,6Pin,H1.4mm,Hinged Type,with CD Pin KLS1-SIM-101
Product Images Product Information Nano SIM Card Connector,6Pin,H1.4mm,Hinged Type,with CD Pin Material: Housing:High Temperature Thermoplastic,UL94V-0.Black. Terminal:Copper Alloy,Plated Gold on the contact area and solder tails,Underplated Nickel over all. Shell:Stainless Steel,Plated gold on the solder tails,Underplated Nickel over all. Electrical: Rated current:0.5A Max Rated Voltage:30V AC Contact Resistance:100mΩ Max. Insulation Resistance:1000MΩ Min./500V DC Dielectric Withsta...
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Nano SIM Card Connector,6Pin,H1.4mm,Hinged Type,with CD Pin KLS1-SIM-077A
Product Images Product Information Nano SIM Card Connector,6Pin,H1.4mm,Hinged Type,with CD Pin Material: Insulator:High Temperature Thermoplastic,UL94V-0. Contact:Copper Alloy,Plated 50u” Ni Overall Contact All Au 1U. Shell:SUS.All Ni 30U MIN. Electrical: Current Rating:0.5A AC/DC MAX. Voltage Rating:125V AC/DC Ambient Humidity Range:95% R.H. Max. Contact Resistance:80mΩ Max. Insulation Resistance:100MΩ Min./100V DC Mating Cycles:5000 Insertions. Operating Temperature: -45ºC~+85...
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Nano SIM Card Connector,6Pin,H1.4mm,Hinged Type,without CD Pin KLS1-SIM-077
Product Images Nano SIM Card Connector,6Pin,H1.4mm,Hinged Type,without CD Pin Material: Insulator:High Temperature Thermoplastic,UL94V-0. Contact:C5210,Plated 50u” Ni Overall Contact All Au 1U. Shell:SUS.All Ni 30U/MIN. Electrical: Current Rating:0.5A Voltage Rating:5V AC/DC Ambient Humidity Range:95% R.H. Max. Contact Resistance:80mΩ Max. Insulation Resistance:100MΩ Min./100V DC Mating Cycles:10000 Insertions. Operating Temperature: -45ºC~+85ºC Nano SIM Card Connector,6Pin,H1....
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Nano SIM Card Connector,PUSH PULL,6Pin,H1.4mm,with CD Pin KLS1-SIM-092
Product Images Product Information Nano SIM Card Connector,PUSH PULL,6Pin,H1.4mm,with CD Pin Material: Housing:Hi-Temperature Thermoplastic,UL94V-0.Black. Terminal:Copper Alloy,selective 1u” Au on contact area. Shell:Stainless Steel.selective Gold Flash on solder area. Electrical: Rated current:0.5A Max Rated Voltage:30V AC Contact Resistance:100mΩ Max. Insulation Resistance:1000MΩ Min./500V DC Dielectric Withstanding Voltage:500V AC/minute. Durability:5000 Cycles. Operating Te...
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Nano SIM Card Connector;PUSH PULL,6Pin,H1.35mm KLS1-SIM-076
Product Images Product Information Nano SIM Card Connector;PUSH PULL,6Pin,H1.35mm Material: Insulator:High Temperature Thermoplastic,UL94V-0. Contact:C5210.Plated 50u” Ni Overall,Contact All Au 1u. Shell:SUS,Plated 50u” Ni Overall,PAD Au 1u. Electrical: Current Rating:0.5A AC/DC max. Voltage Rating:125V AC/DC Contact Resistance:100mΩ Max. Insulation Resistance:1000MΩ Min.500V DC Operating Temperature: -45ºC~+85ºC
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Nano SIM Card Connector;PUSH PULL,6Pin,H1.2mm KLS1-SIM-D01
Product Images Product Information Material: Housing:High Temp.Thermoplastic,UL94V-0.Black Contact:Copper Alloy 0.10T,Gold Flash On Contact Area and Solder Area 50U” Min Nickel Under-Plated Shell:Stainless Steel 0.10T,Nickel Plating Over ALL Electrical: Current Rating:1A Contact Resistance:100mΩ Max. Insulation Resistance:500MΩ Min Dielectric Withstanding Voltage:500V R.M.S. Min Life Test:1500 Cycles
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