XFP 30Pos SMD Connector KLS12-XFP-01
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Features:
Capable of 10Gbps data signal speeds 15 or 30-microinch gold plating.
High-speed contact design.
SMT design in tape reel or tray packaging.
Advanced stamping technology for smooth contact surface.
Material：
Insulators：Polyester Thermoplastics Glass Fibre Filled, UL 94V-0
Contact：Copper Alloy With Au Plated.
Electrical：
Contact Resistance：△R10 milliohms Max. for signal contacts
Insulation Resistance：1000MΩ Min. Current Rating：0.5 Amps Max. per contact
Mechanical：
Transceiver Insertion Force：40N Max.
Transceiver Extraction Force：30N Max.
Durability：100 Cycles Min.
Operating Temperature Range：-20°C to +85°C